W25Q64JVXGJM

Detailed Description:

The W25Q64JVXGJM is a high-performance 64Mb SPI flash memory module manufactured by Winbond, a leading global supplier of semiconductor memory solutions. This module is part of the W25Q series, known for its reliability and efficiency in a wide range of applications, including embedded systems, computing, and consumer electronics. The W25Q64JVXGJM offers a flexible and robust storage solution with its SPI (Serial Peripheral Interface) enabling high-speed data transfer rates. The module supports standard SPI, Dual SPI, and Quad SPI operation, allowing for versatile interfacing with microcontrollers and processors. Moreover, it provides advanced features such as sector erase, block erase, and full chip erase, making it a highly flexible option for applications that require frequent or precise data management. Its low power consumption and wide voltage range operation make it exceptionally suitable for battery-operated devices. The Winbond W25Q64JVXGJM is ideal for applications demanding substantial data storage, high speed, and reliability in compact footprints, such as portable devices, IoT applications, and advanced consumer electronics.