W25Q256FVEIM

Detailed Description:

The W25Q256FVEIM is a high-capacity, high-performance 256Mb SpiFlash memory module designed and manufactured by Winbond. As a key player in the flash memory market, Winbond’s W25Q256FVEIM offers a robust storage solution for a wide array of applications. This SPI (Serial Peripheral Interface) Flash memory device provides a reliable means for data storage with its high-speed data transfer capabilities and low power consumption. The memory is organized into programmable pages that are suitable for various applications, including mobile devices, digital cameras, and IoT devices. Its 256Mb capacity makes it a suitable choice for storing firmware, parameters, or data logging information. The device supports standard SPI, dual SPI, and quad SPI, enabling high data throughput. The W25Q256FVEIM is encapsulated in a 16-pin SOP (Small Outline Package) making it an ideal choice for compact and space-constrained designs. The versatility and performance of the W25Q256FVEIM make it an essential component in the design and development of advanced electronic systems.