QCC3001-2-68CSP

Detailed Description:

The QCC3001-2-68CSP by Qualcomm is a dedicated Bluetooth Audio System-on-Chip (SoC) crafted for mono headset applications, encapsulated in a BGA (Ball Grid Array) package with 68 pins. This component is part of Qualcomm’s Bluetooth audio SoC family, designed to offer manufacturers a superior, compact solution for creating high-quality mono audio devices. With its emphasis on mono audio, this SoC provides an optimized experience for voice communication, supporting the crucial need for clear, uninterrupted voice transmission in applications such as Bluetooth headsets, wearable devices, and more. The 68-pin BGA packaging allows for a reliable electrical connection and robust physical integration in a variety of device form factors. The SoC stands out for its balance between performance and power efficiency, enabling longer battery life in devices where continuous operation is essential. Overall, the QCC3001-2-68CSP is specifically engineered to meet the demands of contemporary mono audio applications, ensuring premium sound quality, dependable connectivity, and extended device usability.