FCBGA900

Detailed Description:

The FCBGA900, specifically tagged as SoC FPGA XCZU6CG-1FFVC900E, is a high-performance system-on-chip (SoC) field-programmable gate array (FPGA) component manufactured by Xilinx. This sophisticated electronic component integrates advanced FPGA technology with a robust ARM processing system, making it an ideal choice for complex digital computing tasks. Its designation, FCBGA900, refers to its packaging type – Flip Chip Ball Grid Array, with 900 connection points, ensuring a reliable and dense interconnect with the printed circuit board. This device, part of Xilinx’s Zynq Ultrascale+ family, is engineered to support a wide range of applications, from signal processing to image recognition, by providing significant computational power and flexibility. With the ability to reprogram the FPGA fabric, engineers can tailor the SoC to specific requirements, enhancing the device’s efficacy in emerging and evolving technologies. The XCZU6CG-1FFVC900E is designed to meet the needs of industries demanding high-speed data processing and real-time analytics, including but not limited to telecommunications, automotive, and aerospace sectors.