Get in touch
Close

Contacts

A’Posh BizHub 1 Yishun Industrial Street 1, Singapore 768160


+65 3158 0366

service@win-source.net

FUJITSU CA05950-2125 – Cabling Data System board (SLIMLINE 1/3) first/second EDSFF Backplane

Part No FUJITSU CA05950-2125 – Cabling Data System board (SLIMLINE 1/3) first/second EDSFF Backplane
Manufacturer Fujitsu Electronics America, Inc.
Catalog Cables
Description This Fujitsu data cable connects the system board (Slimline 1/3) to the first or second EDSFF backplane.
Rohs State Need to verify

SKU: 1401526
Category:
Brand: ,
Manufacturer Fujitsu Elektronik Amerika, Inc.
Win Source Part Number 1401526-FUJITSU CA05950-2125 – Verkabelung Datensystemplatine (SLIMLINE 1/3) erste/zweite EDSFF Backplane
Category Kabel

Detailed Description:

The FUJITSU CA05950-2125 Cabling Data System Board is engineered to facilitate seamless connectivity within the data center’s backbone. It’s specifically designed to connect the SLIMLINE 1/3 to the first or second EDSFF (Enterprise & Datacenter SSD Form Factor) Backplane. This high-quality cable solution is essential for establishing a reliable, high-speed link between the system board and the storage or server backplanes. Its exceptional craftsmanship guarantees optimized signal integrity and minimizes the risk of data transmission errors, which is crucial for maintaining system reliability and performance. Compatibility with EDSFF backplanes paves the way for adopting next-generation storage technologies, ensuring your infrastructure can keep pace with evolving data demands. The precise length and flexibility of the cable facilitate easy installation and routing within tight spaces, simplifying system setup and maintenance. By delivering outstanding durability and performance, the FUJITSU CA05950-2125 is a cornerstone in building efficient, future-proof data centers and IT environments.

Reviews

There are no reviews yet.

Be the first to review “FUJITSU CA05950-2125 – Cabling Data System board (SLIMLINE 1/3) first/second EDSFF Backplane”

Your email address will not be published. Required fields are marked *